Wide-range 2D InP chip-to-fiber alignment through bimorph piezoelectric actuators

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Samenvatting

A method to relax opto-electronic packaging tolerances is proposed and demonstrated using a low-power, bimorph, piezo-electric alignment system capable of compensating the misalignment between an InP waveguide and a lensed optical fiber in a 100 μm2 misalignment range. This is expected to enable the use of relaxed tolerance pick and place tools.

Originele taal-2Engels
TitelProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's1124-1129
Aantal pagina's6
Volume2018-May
ISBN van geprinte versie9781538649985
DOI's
StatusGepubliceerd - 7 aug 2018
Evenement68th IEEE Electronic Components and Technology Conference, (ECTC 2018) - San Diego, Verenigde Staten van Amerika
Duur: 29 mei 20181 jun 2018
https://www.merckgroup.com/en/events/ectc-2018.html

Congres

Congres68th IEEE Electronic Components and Technology Conference, (ECTC 2018)
Verkorte titelECTC2018
Land/RegioVerenigde Staten van Amerika
StadSan Diego
Periode29/05/181/06/18
Internet adres

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