Wafer-to-order allocation in semiconductor back-end production

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

1 Citaat (Scopus)


This paper discusses the development of an efficient algorithm that minimizes overproduction in the allocation of wafers to customer orders prior to assembly at a semiconductor production facility. This study is motivated by and tested at Nexperia’s assembly and test facilities, but its potential applications extend to many manufacturers in the semiconductor industry. Inspired by the classic bin covering problem, the wafer allocation problem is formulated as an integer linear program (ILP). A novel heuristic is proposed, referred to as the multi-start swap algorithm, which is compared to current practice, other existing heuristics and benchmarked with a commercial optimization solver. Experiments with real-world data sets show that the proposed solution method significantly outperforms current practice and other existing heuristics, and that the overall performance is generally close to optimal. Furthermore, some data processing steps and
heuristics are presented to make the ILP applicable to real-world applications.
Originele taal-2Engels
TitelWSC 2019- 2019 Winter Simulation Conference
RedacteurenN. Mustafee, K.-H.G. Bae, S. Lazarova-Molnar, M. Rabe, C. Szabo, P. Haas, Y.-J. Son
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's12
ISBN van elektronische versie978-1-7281-3283-9
StatusGepubliceerd - dec 2019
Evenement2019 Winter Simulation Conference (WSC 2019) - National Harbor, MD, USA, National Harbor, Verenigde Staten van Amerika
Duur: 8 dec 201911 dec 2019


Congres2019 Winter Simulation Conference (WSC 2019)
Verkorte titelWSC2019
Land/RegioVerenigde Staten van Amerika
StadNational Harbor
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