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Variability study of MWCNT local interconnects considering defects and contact resistances-Part II: Impact of charge transfer doping

  • Rongmei Chen
  • , Jie Liang
  • , Jaehyun Lee
  • , Vihar P. Georgiev
  • , Raphael Ramos
  • , Hanako Okuno
  • , Dipankar Kalita
  • , Yuanqing Cheng
  • , Liuyang Zhang
  • , Reetu R. Pandey
  • , Salvatore Amoroso
  • , Campbell Millar
  • , Asen Asenov
  • , Jean Dijon
  • , Aida Todri-Sanial

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

Samenvatting

In this paper, the impact of charge transfer doping on the variability of multiwalled carbon nanotube (MWCNT) local interconnects is studied by experiments and simulations. We calculate the number of conducting channels of both metallic and semiconducting carbon nanotubes as a function of Fermi level shift due to doping based on the calculation of transmission coefficients. By using the MWCNT compact model proposed in Part I of this paper, we study the charge transfer doping of MWCNTs employing Fermi level shift to reduce the performance variability due to changes in diameter, chirality, defects, and contact resistance. Simulation results show that charge transfer doping can significantly improve MWCNT interconnect performance and variability by increasing the number of conducting channels of shells and degenerating semiconducting shells to metallic shells. As a case study on an MWCNT of 11 nm outer diameter, when the Fermi level shifts to 0.1 eV, up to 80% of performance and standard deviation improvements are observed. Furthermore, a good match between experimental data and simulation results is observed, demonstrating the effectiveness of doping, the validity of the MWCNT compact model and proposed simulation methodology.

Originele taal-2Engels
Artikelnummer8466013
Pagina's (van-tot)4963-4970
Aantal pagina's8
TijdschriftIEEE Transactions on Electron Devices
Volume65
Nummer van het tijdschrift11
DOI's
StatusGepubliceerd - nov. 2018
Extern gepubliceerdJa

Bibliografische nota

Publisher Copyright:
© 2018 IEEE.

Financiering

Manuscript received May 7, 2018; revised July 11, 2018; accepted August 26, 2018. Date of publication September 14, 2018; date of current version October 22, 2018. This work was supported by the European Commission H2020 CONNECT Project under Grant 688612. The review of this paper was arranged by Editor M. S. Bakir. (Corresponding author: Rongmei Chen.) R. Chen , J. Liang, R. R. Pandey, and A. Todri-Sanial are with the Microelectronics Department, LIRMM, CNRS, University of Mont-pellier, 34095 Montpellier, France (e-mail: [email protected]; [email protected]). J. Lee, V. P. Georgiev, and A. Asenov are with the School of Engineering, University of Glasgow, Glasgow G12 8QQ, U.K. R. Ramos and J. Dijon are with CEA-LITEN, University Grenoble Alpes, 38000 Grenoble, France. H. Okuno and D. Kalita are with CEA-INAC, University Grenoble Alpes, 38000 Grenoble, France. Y. Cheng and L. Zhang are with the School of Electronic and Information Engineering, Beihang University, Beijing 100191, China. S. Amoroso and C. Millar are with Synopsys Ltd., Glasgow, U.K. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TED.2018.2868424

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