Training procedure for scanning electron microscope 3D surface reconstruction using unsupervised domain adaptation with simulated data

Accurate metrology techniques for semiconductor devices are indispensable for controlling the manufacturing process. For instance, the dimensions of a transistor’s current channel (fin) are an important indicator of the device’s performance regarding switching voltages and parasitic capacities. We expand upon traditional 2D analysis by utilizing computer vision techniques for full-surface reconstruction. We propose a data-driven approach that predicts the dimensions, height and width (CD) values, of fin-like structures. During operation, the method solely requires experimental images from a scanning electron microscope of the patterns concerned. We introduce an unsupervised domain adaptation step to overcome the domain gap between experimental and simulated data. Our model is further fine-tuned with a height measurement from a second scatterometry sensor and optimized through a tailored training scheme for optimal performance. The proposed method results in accurate depth predictions, namely 100% accurate interwafer classification with an root-mean-squared error of 0.67 nm. The R2 of the intrawafer performance on height is between 0.59 and 0.70. Qualitative results also indicate that detailed surface features, such as corners, are accurately predicted. Our study shows that accurate z-metrology techniques can be viable for high-volume manufacturing.