Thermal flow sensors on flexible substrates for minimally invasive medical instruments

B. Mimoun, A. van der Horst, D. van der Voort, M. Rutten, F.N. van de Vosse, R. Dekker

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

13 Citaties (Scopus)

Uittreksel

We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. 

Originele taal-2Engels
TitelProceedings of IEEE Sensors
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's4
ISBN van geprinte versie9781457717659
DOI's
StatusGepubliceerd - 2012
Evenement11th IEEE SENSORS 2012 Conference - Taipei, Taiwan
Duur: 28 okt 201231 okt 2012

Congres

Congres11th IEEE SENSORS 2012 Conference
LandTaiwan
StadTaipei
Periode28/10/1231/10/12

Vingerafdruk

Thermopiles
Sensors
Substrates
Electric heating elements
Seebeck coefficient
Catheters
Channel flow
Polyimides
Printed circuit boards
Blood
Wire
Silicon
Hot Temperature
Temperature

Citeer dit

Mimoun, B., van der Horst, A., van der Voort, D., Rutten, M., van de Vosse, F. N., & Dekker, R. (2012). Thermal flow sensors on flexible substrates for minimally invasive medical instruments. In Proceedings of IEEE Sensors [6411429] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ICSENS.2012.6411429
Mimoun, B. ; van der Horst, A. ; van der Voort, D. ; Rutten, M. ; van de Vosse, F.N. ; Dekker, R. / Thermal flow sensors on flexible substrates for minimally invasive medical instruments. Proceedings of IEEE Sensors. Piscataway : Institute of Electrical and Electronics Engineers, 2012.
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Mimoun, B, van der Horst, A, van der Voort, D, Rutten, M, van de Vosse, FN & Dekker, R 2012, Thermal flow sensors on flexible substrates for minimally invasive medical instruments. in Proceedings of IEEE Sensors., 6411429, Institute of Electrical and Electronics Engineers, Piscataway, 11th IEEE SENSORS 2012 Conference, Taipei, Taiwan, 28/10/12. https://doi.org/10.1109/ICSENS.2012.6411429

Thermal flow sensors on flexible substrates for minimally invasive medical instruments. / Mimoun, B.; van der Horst, A.; van der Voort, D.; Rutten, M.; van de Vosse, F.N.; Dekker, R.

Proceedings of IEEE Sensors. Piscataway : Institute of Electrical and Electronics Engineers, 2012. 6411429.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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AB - We present a flexible polyimide-based calorimetric thermal flow sensor featuring two thermopiles and a heating element perpendicular to the flow direction, connected to a rigid silicon chip containing the bondpads for standard wire bonding. After measurement of the temperature coefficient of resistance of the heater (TCR) and the Seebeck coefficient of the thermopiles of the sensor, the devices are mounted on a printed circuit board (PCB) flow channel and tested in constant power (CP) mode under both steady and dynamic flow conditions. The obtained results are in good agreement with previous research on similar, less flexible, flow sensors. The presented device can then potentially be wrapped around catheters or guidewires for intravascular blood flow assessment. 

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Mimoun B, van der Horst A, van der Voort D, Rutten M, van de Vosse FN, Dekker R. Thermal flow sensors on flexible substrates for minimally invasive medical instruments. In Proceedings of IEEE Sensors. Piscataway: Institute of Electrical and Electronics Engineers. 2012. 6411429 https://doi.org/10.1109/ICSENS.2012.6411429