Thermal and wiring optimizations of dense SOA arrays on an adhesively bonded InP membrane

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

113 Downloads (Pure)

Originele taal-2	Engels
Titel	Proceedings of 23rd European Conference on Integrated Optics
Uitgeverij	Politecnico di Milano
Hoofdstuk	W.P.2
Aantal pagina's	3
Status	Gepubliceerd - 4 mei 2022
Evenement	23rd European Conference on Integrated Optics (ECIO 2022) - Politecnico di Milano, Milan, Italië Duur: 4 mei 2022 → 6 mei 2022 Congresnummer: 23 http://www.ecio-conference.org

Congres	23rd European Conference on Integrated Optics (ECIO 2022)
Verkorte titel	ECIO 2022
Land/Regio	Italië
Stad	Milan
Periode	4/05/22 → 6/05/22
Internet adres	http://www.ecio-conference.org

Toegang tot document

@inproceedings{a7a926a0c60242ef9946f0691b31ab1c,

title = "Thermal and wiring optimizations of dense SOA arrays on an adhesively bonded InP membrane",

author = "Yi Wang and {van Engelen}, Jorn and Victor Dolores-Calzadilla and Kevin Williams and Meint Smit and Yuqing Jiao",

year = "2022",

month = may,

day = "4",

language = "English",

booktitle = "Proceedings of 23rd European Conference on Integrated Optics",

publisher = "Politecnico di Milano",

note = "23rd European Conference on Integrated Optics (ECIO 2022), ECIO 2022 ; Conference date: 04-05-2022 Through 06-05-2022",

url = "http://www.ecio-conference.org",

}

TY - GEN

T1 - Thermal and wiring optimizations of dense SOA arrays on an adhesively bonded InP membrane

AU - Wang, Yi

AU - van Engelen, Jorn

AU - Dolores-Calzadilla, Victor

AU - Williams, Kevin

AU - Smit, Meint

AU - Jiao, Yuqing

N1 - Conference code: 23

PY - 2022/5/4

Y1 - 2022/5/4

M3 - Conference contribution

BT - Proceedings of 23rd European Conference on Integrated Optics

PB - Politecnico di Milano

T2 - 23rd European Conference on Integrated Optics (ECIO 2022)

Y2 - 4 May 2022 through 6 May 2022

ER -