The use of electronic speckle pattern interferometry (ESPI) to determine the displacements in thin adhesive layers under increasing loads

H. Botter, H.L.M. Wijen, A.H. Berg, van den, F. Soetens, IJ.J. Straalen, van, A. Vlot

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Originele taal-2Engels
TitelProceedings of the 6th International Conference on Structural Adhesives in Engineering
Plaats van productieBristol UK
StatusGepubliceerd - 2001
Evenementconference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06 -
Duur: 4 jul 20016 jul 2001

Congres

Congresconference; 6th International Conference on Structural Adhesives in Engineering; 2001-07-04; 2001-07-06
Periode4/07/016/07/01
Ander6th International Conference on Structural Adhesives in Engineering

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