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The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations

  • Jaehyun Lee
  • , Salim Berrada
  • , Jie Liang
  • , Toufik Sadi
  • , Vihar P. Georgiev
  • , Aida Todri-Sanial
  • , Dipankar Kalita
  • , Raphael Ramos
  • , Hanako Okuno
  • , Jean Dijon
  • , Asen Asenov

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

We have performed statistical atomistic simulations with tight-binding approach to investigate the effects of randomly distributed mono-vacancy defects in metallic single-walled carbon nanotube (SWCNT) interconnects. We also extracted defective resistances from the atomistic simulations and performed circuit-level simulations to compare the performance of interconnects with and without defects. We have found that the defects induce significant fluctuations of SWCNT resistance with a median value showing an Ohmic-like behaviour. Fortunately, the resistance depends only on the diameter of SWCNTs and not on their chirality. Moreover, our circuit simulations show that the defective resistance induces important propagation time delay ratio that should be accounted for when designing CNT interconnects.

Originele taal-2Engels
Titel2017 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2017
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's157-160
Aantal pagina's4
ISBN van elektronische versie9784863486102
DOI's
StatusGepubliceerd - 25 okt. 2017
Extern gepubliceerdJa
Evenement2017 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2017 - Kamakura, Japan
Duur: 7 sep. 20179 sep. 2017

Congres

Congres2017 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2017
Land/RegioJapan
StadKamakura
Periode7/09/179/09/17

Bibliografische nota

Publisher Copyright:
© 2017 The Japan Society of Applied Physics.

Financiering

ACKNOWLEDGMENT This work is supported by EU H2020 CONNECT project under grant agreement No. 688612, http://www.connecth2020.eu/.

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