Temperature Sensing Diode in InP-Based Photonic Integration Technology

Wenjing Tian (Corresponding author), Bart Bas, Dylan Harmsen, Kevin Williams, Xaveer Leijtens

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3 Citaten (Scopus)
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Samenvatting

The integration of temperature sensors directly onto photonic platforms facilitates the thermal management of advanced photonic integrated circuits. This paper presents monolithic temperature sensors on the indium-phosphide-based photonic integration technology. Two distinct sensors were developed using p-i-n diode junctions with different waveguide core layers, one composed of multiple quantum wells and the other of bulk indium gallium arsenide phosphide. Introducing these sensors to an indium-phosphide-based generic foundry platform required zero process modifications. Theoretical, simulation, and measurement results consistently reveal a linear relationship between the forward voltage of the sensors and temperature under constant current biasing. The measurement results highlight that the compact sensors with dimensions of 30 × 10 μm achieve the highest sensitivity of -2.1 mV/K. These sensors boast a simple structure, easy operation, straightforward temperature interpretation, and high compatibility with the foundry process. They present immunity to on-chip (stray) light, a critical feature when operating alongside integrated lasers. The results demonstrate the feasibility of local temperature measurement and monitoring of photonic integrated circuits.

Originele taal-2Engels
Artikelnummer10460995
Aantal pagina's8
TijdschriftIEEE Photonics Journal
Volume16
Nummer van het tijdschrift2
DOI's
StatusGepubliceerd - 2 apr. 2024

Financiering

This workwas supported in part by the European Union through Eurostars FLEXFIX Program nr. 2018.29, and in part by Microsoft Research through its Ph.D. Scholarship Programme.

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