TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany

A. Schmidt; H. Gellersen; E.A.W.H. Hoven, van den; A. Mazalek; P. Holleis; N. Villar

TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany

A. Schmidt (Redacteur), H. Gellersen (Redacteur), E.A.W.H. Hoven, van den (Redacteur), A. Mazalek (Redacteur), P. Holleis (Redacteur), N. Villar (Redacteur)

Onderzoeksoutput: Boek/rapport › Boekredactie › Academic › peer review

Originele taal-2	Engels
Plaats van productie	New York
Uitgeverij	Association for Computing Machinery, Inc
Aantal pagina's	267
ISBN van geprinte versie	978-1-60558-004-3
Status	Gepubliceerd - 2008

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TEI'08 : second international conference on tangible and embedded interaction : conference proceedings, February 18-20, 2008, Bonn, Germany. / Schmidt, A. (Redacteur); Gellersen, H. (Redacteur); Hoven, van den, E.A.W.H. (Redacteur) et al.
New York: Association for Computing Machinery, Inc, 2008. 267 blz.

Onderzoeksoutput: Boek/rapport › Boekredactie › Academic › peer review

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