TEI goes on : tangible and embedded interaction

E. Hornecker, R.J.K. Jacob, C.C.M. Hummels, B. Ullmer, A. Schmidt, E.A.W.H. Hoven, van den, A. Mazalek

    Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

    34 Citaties (SciVal)
    4 Downloads (Pure)


    The first article reports on context-sensitive augmented-reality research presented at the 2007 International Symposium on Ubiquitous Virtual Reality. This student-organized event explored the use of contextual information, design principles, and effective user evaluation for developing AR applications for ubiquitous computing environments. The second article reports on The International Conference on Tangible and Embedded Interaction, the first conference series worldwide to focus on tangible and embedded interaction. The conference is interdisciplinary, covering the arts, hardware design, software toolkits for prototyping, and user studies and theory development.

    Originele taal-2Engels
    Pagina's (van-tot)91-96
    TijdschriftIEEE Pervasive Computing
    Nummer van het tijdschrift2
    StatusGepubliceerd - 1 apr 2008
    Evenement2nd International Conference on Tangible and Embedded Interaction (TEI 2008) - Bonn, Duitsland
    Duur: 18 feb 200820 feb 2008
    Congresnummer: 2


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