TEI goes on : tangible and embedded interaction

E. Hornecker, R.J.K. Jacob, C.C.M. Hummels, B. Ullmer, A. Schmidt, E.A.W.H. Hoven, van den, A. Mazalek

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

32 Citaten (Scopus)
2 Downloads (Pure)


The first article reports on context-sensitive augmented-reality research presented at the 2007 International Symposium on Ubiquitous Virtual Reality. This student-organized event explored the use of contextual information, design principles, and effective user evaluation for developing AR applications for ubiquitous computing environments. The second article reports on The International Conference on Tangible and Embedded Interaction, the first conference series worldwide to focus on tangible and embedded interaction. The conference is interdisciplinary, covering the arts, hardware design, software toolkits for prototyping, and user studies and theory development.

Originele taal-2Engels
Pagina's (van-tot)91-96
TijdschriftIEEE Pervasive Computing
Nummer van het tijdschrift2
StatusGepubliceerd - 1 apr 2008
Evenement2nd International Conference on Tangible and Embedded Interaction (TEI 2008) - Bonn, Duitsland
Duur: 18 feb 200820 feb 2008
Congresnummer: 2

Vingerafdruk Duik in de onderzoeksthema's van 'TEI goes on : tangible and embedded interaction'. Samen vormen ze een unieke vingerafdruk.

  • Citeer dit

    Hornecker, E., Jacob, R. J. K., Hummels, C. C. M., Ullmer, B., Schmidt, A., Hoven, van den, E. A. W. H., & Mazalek, A. (2008). TEI goes on : tangible and embedded interaction. IEEE Pervasive Computing, 7(2), 91-96. [4487094]. https://doi.org/10.1109/MPRV.2008.27