Technical Debt Problems and Concerns

Jeffrey C. Carver, Xabier Larrucea, Alexander Serebrenik, Miroslaw Staron

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Samenvatting

This article reports papers about technical debt (TD) from the 2021 IEEE/Association for Computing Machinery (ACM) International Conference on technical debt (TechDebt’21), the 43rd IEEE/ACM International Conference on Software Engineering: Journal First Track (ICSE-JF’21), the 43rd IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice Track (ICSE-SEIP’21), and the 2021 IEEE/ACM 18th International Conference on Mining Software Repositories (MSR’21). Feedback or suggestions are welcome. In addition, if you try or adopt any of the practices included in the column, please send us and the authors a note about your experiences.
Originele taal-2Engels
Pagina's (van-tot)116-119
Aantal pagina's4
TijdschriftIEEE Software
Volume39
Nummer van het tijdschrift3
DOI's
StatusGepubliceerd - 1 mei 2022

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