Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

Piyush Kaul; Alhassan Aljarosha; A.B. Smolders; M.K. Matters-Kammerer; Rob Maaskant

doi:10.1109/EuMIC48047.2021.00066

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

Piyush Kaul
, Alhassan Aljarosha
, A.B. Smolders
, M.K. Matters-Kammerer
, Rob Maaskant

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

4 Citaten (Scopus)

3 Downloads (Pure)

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In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

Originele taal-2	Engels
Titel	2020 15th European Microwave Integrated Circuits Conference (EuMIC)
Uitgeverij	Institute of Electrical and Electronics Engineers
Pagina's	217-220
Aantal pagina's	4
ISBN van elektronische versie	978-2-87487-060-6
ISBN van geprinte versie	978-1-7281-7040-4
DOI's	https://doi.org/10.1109/EuMIC48047.2021.00066
Status	Gepubliceerd - 3 feb. 2021
Evenement	15th European Microwave Integrated Circuits Conference (EuMIC 2020) - Utrecht, Nederland Duur: 11 jan. 2021 → 15 jan. 2021 Congresnummer: 15

Congres

Congres	15th European Microwave Integrated Circuits Conference (EuMIC 2020)
Verkorte titel	EuMIC 2020
Land/Regio	Nederland
Stad	Utrecht
Periode	11/01/21 → 15/01/21

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Kaul, P., Aljarosha, A., Smolders, A. B., Matters-Kammerer, M. K., & Maaskant, R. (2021). Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. In 2020 15th European Microwave Integrated Circuits Conference (EuMIC) (blz. 217-220). Artikel 9337459 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuMIC48047.2021.00066

@inproceedings{1629ecd104614f64a61e8bcde4b384bc,

title = "Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition",

abstract = "In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.",

keywords = "Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization, impedance matching, waveguide transitions, Co-design, system integration, millimeter-wave integrated circuits, power amplifiers, spatial power combiners",

author = "Piyush Kaul and Alhassan Aljarosha and A.B. Smolders and M.K. Matters-Kammerer and Rob Maaskant",

year = "2021",

month = feb,

day = "3",

doi = "10.1109/EuMIC48047.2021.00066",

language = "English",

isbn = "978-1-7281-7040-4",

pages = "217--220",

booktitle = "2020 15th European Microwave Integrated Circuits Conference (EuMIC)",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "15th European Microwave Integrated Circuits Conference (EuMIC 2020), EuMIC 2020 ; Conference date: 11-01-2021 Through 15-01-2021",

}

Kaul, P, Aljarosha, A, Smolders, AB , Matters-Kammerer, MK & Maaskant, R 2021, Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. in 2020 15th European Microwave Integrated Circuits Conference (EuMIC)., 9337459, Institute of Electrical and Electronics Engineers, blz. 217-220, 15th European Microwave Integrated Circuits Conference (EuMIC 2020), Utrecht, Nederland, 11/01/21. https://doi.org/10.1109/EuMIC48047.2021.00066

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. / Kaul, Piyush; Aljarosha, Alhassan; Smolders, A.B. et al.
2020 15th European Microwave Integrated Circuits Conference (EuMIC). Institute of Electrical and Electronics Engineers, 2021. blz. 217-220 9337459.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

AU - Kaul, Piyush

AU - Aljarosha, Alhassan

AU - Smolders, A.B.

AU - Matters-Kammerer, M.K.

AU - Maaskant, Rob

N1 - Conference code: 15

PY - 2021/2/3

Y1 - 2021/2/3

N2 - In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

AB - In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

KW - Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization

KW - impedance matching

KW - waveguide transitions

KW - Co-design

KW - system integration

KW - millimeter-wave integrated circuits

KW - power amplifiers

KW - spatial power combiners

UR - https://www.scopus.com/pages/publications/85100914955

U2 - 10.1109/EuMIC48047.2021.00066

DO - 10.1109/EuMIC48047.2021.00066

M3 - Conference contribution

SN - 978-1-7281-7040-4

SP - 217

EP - 220

BT - 2020 15th European Microwave Integrated Circuits Conference (EuMIC)

PB - Institute of Electrical and Electronics Engineers

T2 - 15th European Microwave Integrated Circuits Conference (EuMIC 2020)

Y2 - 11 January 2021 through 15 January 2021

ER -

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

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