Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

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In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.
Originele taal-2Engels
Titel2020 15th European Microwave Integrated Circuits Conference (EuMIC)
Plaats van productieUtrecht, The Netherlands
UitgeverijInstitute of Electrical and Electronics Engineers
ISBN van elektronische versie978-2-87487-060-6
ISBN van geprinte versie978-1-7281-7040-4
DOI's
StatusGepubliceerd - 3 feb 2021

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