Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

Piyush Kaul; Alhassan Aljarosha; A.B. Smolders; M.K. Matters-Kammerer; Rob Maaskant

doi:0.1109/EuMIC48047.2021.00066

Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

Piyush Kaul, Alhassan Aljarosha, A.B. Smolders, M.K. Matters-Kammerer, Rob Maaskant

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

Samenvatting

In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

Originele taal-2	Engels
Titel	2020 15th European Microwave Integrated Circuits Conference (EuMIC)
Plaats van productie	Utrecht, The Netherlands
Uitgeverij	Institute of Electrical and Electronics Engineers
ISBN van elektronische versie	978-2-87487-060-6
ISBN van geprinte versie	978-1-7281-7040-4
DOI's	https://doi.org/0.1109/EuMIC48047.2021.00066
Status	Gepubliceerd - 3 feb 2021

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0.1109/EuMIC48047.2021.00066

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Citeer dit

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title = "Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition",

abstract = "In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.",

keywords = "Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization",

author = "Piyush Kaul and Alhassan Aljarosha and A.B. Smolders and M.K. Matters-Kammerer and Rob Maaskant",

year = "2021",

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doi = "0.1109/EuMIC48047.2021.00066",

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Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition. / Kaul, Piyush ; Aljarosha, Alhassan ; Smolders, A.B.; Matters-Kammerer, M.K.; Maaskant, Rob.

2020 15th European Microwave Integrated Circuits Conference (EuMIC). Utrecht, The Netherlands : Institute of Electrical and Electronics Engineers, 2021.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition

AU - Kaul, Piyush

AU - Aljarosha, Alhassan

AU - Smolders, A.B.

AU - Matters-Kammerer, M.K.

AU - Maaskant, Rob

PY - 2021/2/3

Y1 - 2021/2/3

N2 - In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

AB - In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

KW - Impedance matching, Simulation, Power amplifiers, Silicon, Reflection coefficient, Impedance Optimization

U2 - 0.1109/EuMIC48047.2021.00066

DO - 0.1109/EuMIC48047.2021.00066

M3 - Conference contribution

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CY - Utrecht, The Netherlands

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