Spatial atomic layer deposition: a route towards further industrialization of atomic layer deposition

P. Poodt, D.C. Cameron, E. Dickey, S.M. George, Vladimir Kuznetsov, G.N. Parsons, F. Roozeboom, G. Sundaram, A. Vermeer

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

229 Citaten (Scopus)
1868 Downloads (Pure)

Samenvatting

Spatial atomic layer deposition can be used as a high-throughput manufacturing technique in functional thin film deposition for applications such as flexible electronics. This; however, requires low-temperature processing and handling of flexible substrates. The authors investigate the process conditions under which low-temperature spatial atomic layer deposition of alumina from trimethyl aluminum and water is possible. The water partial pressure is the critical parameter in this case. Finally, our approach to roll-to-roll spatial atomic layer deposition is discussed.
Originele taal-2Engels
Artikelnummer010802
Pagina's (van-tot)010802-1/11
Aantal pagina's5
TijdschriftJournal of Vacuum Science and Technology A: Vacuum, Surfaces, and Films
Volume30
Nummer van het tijdschrift1
DOI's
StatusGepubliceerd - 2012

Vingerafdruk Duik in de onderzoeksthema's van 'Spatial atomic layer deposition: a route towards further industrialization of atomic layer deposition'. Samen vormen ze een unieke vingerafdruk.

Citeer dit