Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies

O. Raz; P. Duan; H.J.S. Dorren

doi:10.1109/3DIC.2014.7152155

Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies

O. Raz
, P. Duan
, H.J.S. Dorren

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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We demonstrate a method for stacking and connecting KGD on each other. The method requires no pre-processing of the ICs and die placement can be done using standard pick and place machines. This novel process allows creating >200um high lithographically defined interconnects and is a simple, scalable and low cost alternative to other techniques for interconnecting 3D stacked ICs.

Originele taal-2	Engels
Titel	Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland
Plaats van productie	Piscataway
Uitgeverij	Institute of Electrical and Electronics Engineers
Pagina's	1-4
DOI's	https://doi.org/10.1109/3DIC.2014.7152155
Status	Gepubliceerd - 2015
Evenement	conference; 3DIC conference - Duur: 1 jan. 2015 → …

Congres

Congres	conference; 3DIC conference
Periode	1/01/15 → …
Ander	3DIC conference

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10.1109/3DIC.2014.7152155

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Raz, O., Duan, P., & Dorren, H. J. S. (2015). Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies. In Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland (blz. 1-4). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/3DIC.2014.7152155

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title = "Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies",

abstract = "We demonstrate a method for stacking and connecting KGD on each other. The method requires no pre-processing of the ICs and die placement can be done using standard pick and place machines. This novel process allows creating >200um high lithographically defined interconnects and is a simple, scalable and low cost alternative to other techniques for interconnecting 3D stacked ICs.",

author = "O. Raz and P. Duan and H.J.S. Dorren",

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doi = "10.1109/3DIC.2014.7152155",

language = "English",

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booktitle = "Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland",

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Raz, O, Duan, P & Dorren, HJS 2015, Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies. in Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland. Institute of Electrical and Electronics Engineers, Piscataway, blz. 1-4, conference; 3DIC conference, 1/01/15. https://doi.org/10.1109/3DIC.2014.7152155

Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies. / Raz, O.; Duan, P.; Dorren, H.J.S.
Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland. Piscataway: Institute of Electrical and Electronics Engineers, 2015. blz. 1-4.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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AB - We demonstrate a method for stacking and connecting KGD on each other. The method requires no pre-processing of the ICs and die placement can be done using standard pick and place machines. This novel process allows creating >200um high lithographically defined interconnects and is a simple, scalable and low cost alternative to other techniques for interconnecting 3D stacked ICs.

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BT - Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland

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Raz O, Duan P, Dorren HJS. Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies. In Proceedings of the 2014 IEEE International 3D Systems Integration Conference (3DIC), 1-3 December 2014, Kinsdale, Ireland. Piscataway: Institute of Electrical and Electronics Engineers. 2015. blz. 1-4 doi: 10.1109/3DIC.2014.7152155

Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies

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