Robust iterative finite element solver for multi-terminal power distribution network resistance extraction

M. Oppeneer, P. Sumant, A.C. Cangellaris

    Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

    7 Citaten (Scopus)

    Samenvatting

    A node-based algebraic multi-grid finite element Laplace solver is demonstrated for the extraction of the multi-terminal DC resistance of the power distribution network at the board and package level. The solver can handle boards of arbitrary complexity, comprehending without numerical difficulties fine features associated with dense clusters of via holes and related voids in the metallization.
    Originele taal-2Engels
    TitelElectrical Performance of Electronic Packaging, 2008 IEEE-EPEP
    UitgeverijInstitute of Electrical and Electronics Engineers
    Pagina's181-184
    ISBN van geprinte versie978-1-4244-2873-1
    DOI's
    StatusGepubliceerd - 2008
    Evenement17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008) - San Jose, Verenigde Staten van Amerika
    Duur: 27 okt. 200829 okt. 2008
    Congresnummer: 17

    Congres

    Congres17th Conference on Electrical Performance of Electronic Packaging (EPEP 2008)
    Verkorte titelEPEP 2008
    Land/RegioVerenigde Staten van Amerika
    StadSan Jose
    Periode27/10/0829/10/08
    Ander17th Conference on Electrical Performance of Electronic Packaging

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