Roadmap for integration of InP based photonics and silicon electronics

K.A. Williams

Roadmap for integration of InP based photonics and silicon electronics

K.A. Williams

Photonic Integration

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic

Samenvatting

We identify the synergies and a roadmap for the intimate integration of InP photonic integrated circuits and Silicon electronic ICs using wafer-scale processes. Advantages are foreseen in terms of bandwidth, energy savings and package simplification.

Originele taal-2	Engels
Titel	Proceedings of the 41st European Conference on Optical Communication (ECOC 2015), 27 September - 1 October 2015, Valencia, Spain
Status	Gepubliceerd - 2015
Evenement	41st European Conference on Optical Communications, ECOC 2015 - Feria Valencia Convention and Exhibition Centre , Valencia, Spanje Duur: 27 sep. 2015 → 1 okt. 2015 Congresnummer: 41 http://www.ecoc2015.org/modules.php?name=webstructure&idwebstructure=1

Congres

Congres	41st European Conference on Optical Communications, ECOC 2015
Verkorte titel	ECOC 2015
Land/Regio	Spanje
Stad	Valencia
Periode	27/09/15 → 1/10/15
Ander	ECOC 2015
Internet adres	http://www.ecoc2015.org/modules.php?name=webstructure&idwebstructure=1

Bibliografische nota

Workshop

Citeer dit

@inproceedings{2103a6410dfb497c8069d0556a1b94a4,

title = "Roadmap for integration of InP based photonics and silicon electronics",

abstract = "We identify the synergies and a roadmap for the intimate integration of InP photonic integrated circuits and Silicon electronic ICs using wafer-scale processes. Advantages are foreseen in terms of bandwidth, energy savings and package simplification.",

author = "K.A. Williams",

note = "Workshop; 41st European Conference on Optical Communications, ECOC 2015, ECOC 2015 ; Conference date: 27-09-2015 Through 01-10-2015",

year = "2015",

language = "English",

booktitle = "Proceedings of the 41st European Conference on Optical Communication (ECOC 2015), 27 September - 1 October 2015, Valencia, Spain",

url = "http://www.ecoc2015.org/modules.php?name=webstructure\&idwebstructure=1",

}

TY - GEN

T1 - Roadmap for integration of InP based photonics and silicon electronics

AU - Williams, K.A.

N1 - Conference code: 41

PY - 2015

Y1 - 2015

N2 - We identify the synergies and a roadmap for the intimate integration of InP photonic integrated circuits and Silicon electronic ICs using wafer-scale processes. Advantages are foreseen in terms of bandwidth, energy savings and package simplification.

AB - We identify the synergies and a roadmap for the intimate integration of InP photonic integrated circuits and Silicon electronic ICs using wafer-scale processes. Advantages are foreseen in terms of bandwidth, energy savings and package simplification.

M3 - Conference contribution

BT - Proceedings of the 41st European Conference on Optical Communication (ECOC 2015), 27 September - 1 October 2015, Valencia, Spain

T2 - 41st European Conference on Optical Communications, ECOC 2015

Y2 - 27 September 2015 through 1 October 2015

ER -

Roadmap for integration of InP based photonics and silicon electronics

Samenvatting

Congres

Bibliografische nota

Vingerafdruk

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