RF interconnects for high-speed and dense photonic integrated circuits

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Samenvatting

We present the development of low loss radio-frequency interconnects for a generic InP photonic integrated platform. The proposed interconnects add a degree of freedom for the routing of RF signals, thereby enabling both high speed and denser photonic integrated circuits (PICs). As the proposed fabrication is carried out by post-processing, it can be integrated in a flexible way within the manufacturing process of PICs.

Originele taal-2Engels
Titel21st International Conference on Transparent Optical Networks, ICTON 2019
Plaats van productiePiscataway
UitgeverijIEEE Computer Society
Aantal pagina's4
ISBN van elektronische versie978-1-7281-2779-8
DOI's
StatusGepubliceerd - 1 jul 2019
Evenement21st International Conference on Transparent Optical Networks, ICTON 2019 - Angers, Frankrijk
Duur: 9 jul 201913 jul 2019
http://www.icton2019.com/index.php

Congres

Congres21st International Conference on Transparent Optical Networks, ICTON 2019
Verkorte titelICTON2019
LandFrankrijk
StadAngers
Periode9/07/1913/07/19
Internet adres

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Citeer dit

Dolores-Calzadilla, V., Yao, W., de Vries, T., & Williams, K. (2019). RF interconnects for high-speed and dense photonic integrated circuits. In 21st International Conference on Transparent Optical Networks, ICTON 2019 [Sa.A5.2 ] Piscataway: IEEE Computer Society. https://doi.org/10.1109/ICTON.2019.8840269