Samenvatting
Platinum and platinum oxide films were deposited by remote plasma atomic layer deposition (ALD) from the combination of (methylcyclopentadienyl)trimethylplatinum (MeCpPtMe3) precursor and O2 plasma. A short O2 plasma exposure (0.5 s) resulted in low resistivity (15 µ O cm), high density (21 g/cm3), cubic Pt films, whereas a longer O2 plasma exposure (5 s) resulted in semiconductive PtO2 films. In situ spectroscopic ellipsometry studies revealed no significant nucleation delay, different from the thermal ALD process with O2 gas which was used as a benchmark. A broad temperature window (100–300°C) for remote plasma ALD of Pt and PtO2 was demonstrated
| Originele taal-2 | Engels |
|---|---|
| Pagina's (van-tot) | G34-G36 |
| Tijdschrift | Electrochemical and Solid-State Letters |
| Volume | 12 |
| Nummer van het tijdschrift | 7 |
| DOI's | |
| Status | Gepubliceerd - 2009 |
Vingerafdruk
Duik in de onderzoeksthema's van 'Remote plasma ALD of platinum and platinum oxide films'. Samen vormen ze een unieke vingerafdruk.Citeer dit
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver