Flexible end-products like banking cards and wearable electronics are about to pervade our lives massively. Due to the fact that flexibility is a must, reliability problems are expected due to the mechanical handling loading conditions the end-product is subjected. This paper presents our effort to predict reliability problems for packages in flexibleend-products. Current field returns indicate that mechanical loadings are causing crack failures in dies and packages. Both parametric 2D and 3D Finite Element models are constructed to analyse the impact of such loadings to the stress levels in the constituents. The results gain a better understanding of reliability issues and, where possible, give suggestions for preventing such issues. With the aid of the simulation results mechanical test methodologies can be designed suitable as to insure a given lifetime statement.
|Tijdschrift||Microelectronics and Reliability : an International Journal and World Abstracting Service|
|Nummer van het tijdschrift||9-11|
|Status||Gepubliceerd - 2006|