Prospects for electronic photonic integration

K.A. Williams

doi:10.1364/IPRSN.2017.IW3A.1

Prospects for electronic photonic integration

K.A. Williams

Photonic Integration

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

2 Downloads (Pure)

Samenvatting

As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

Originele taal-2	Engels
Titel	Advanced Photonics, IPRSN 2017
Plaats van productie	S.l.
Uitgeverij	Optical Society of America (OSA)
Aantal pagina's	3
ISBN van elektronische versie	978-1-943580-30-9
DOI's	https://doi.org/10.1364/IPRSN.2017.IW3A.1
Status	Gepubliceerd - 1 jan 2017
Evenement	Advanced Photonics, IPRSN 2017 - New Orleans, Verenigde Staten van Amerika Duur: 24 jul 2017 → 27 jul 2017

Congres

Congres	Advanced Photonics, IPRSN 2017
Land/Regio	Verenigde Staten van Amerika
Stad	New Orleans
Periode	24/07/17 → 27/07/17

Toegang tot document

10.1364/IPRSN.2017.IW3A.1

Andere bestanden en links

Link to publication in Scopus

Citeer dit

@inproceedings{49bfc8a5254d4f689e9e281329130da8,

title = "Prospects for electronic photonic integration",

abstract = "As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.",

author = "K.A. Williams",

year = "2017",

month = jan,

day = "1",

doi = "10.1364/IPRSN.2017.IW3A.1",

language = "English",

booktitle = "Advanced Photonics, IPRSN 2017",

publisher = "Optical Society of America (OSA)",

address = "United States",

note = "Advanced Photonics, IPRSN 2017 ; Conference date: 24-07-2017 Through 27-07-2017",

}

TY - GEN

T1 - Prospects for electronic photonic integration

AU - Williams, K.A.

PY - 2017/1/1

Y1 - 2017/1/1

N2 - As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

AB - As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

UR - http://www.scopus.com/inward/record.url?scp=85028010179&partnerID=8YFLogxK

U2 - 10.1364/IPRSN.2017.IW3A.1

DO - 10.1364/IPRSN.2017.IW3A.1

M3 - Conference contribution

AN - SCOPUS:85028010179

BT - Advanced Photonics, IPRSN 2017

PB - Optical Society of America (OSA)

CY - S.l.

T2 - Advanced Photonics, IPRSN 2017

Y2 - 24 July 2017 through 27 July 2017

ER -

Prospects for electronic photonic integration

Samenvatting

Congres

Toegang tot document

Andere bestanden en links

Vingerafdruk

Citeer dit