Samenvatting
As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.
Originele taal-2 | Engels |
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Titel | Advanced Photonics, IPRSN 2017 |
Plaats van productie | S.l. |
Uitgeverij | Optical Society of America (OSA) |
Aantal pagina's | 3 |
ISBN van elektronische versie | 978-1-943580-30-9 |
DOI's | |
Status | Gepubliceerd - 1 jan 2017 |
Evenement | Advanced Photonics, IPRSN 2017 - New Orleans, Verenigde Staten van Amerika Duur: 24 jul 2017 → 27 jul 2017 |
Congres
Congres | Advanced Photonics, IPRSN 2017 |
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Land | Verenigde Staten van Amerika |
Stad | New Orleans |
Periode | 24/07/17 → 27/07/17 |