Prospects for electronic photonic integration

K.A. Williams

doi:10.1364/IPRSN.2017.IW3A.1

Prospects for electronic photonic integration

K.A. Williams

Photonic Integration

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

Originele taal-2	Engels
Titel	Advanced Photonics, IPRSN 2017
Plaats van productie	S.l.
Uitgeverij	Optical Society of America (OSA)
Aantal pagina's	3
ISBN van elektronische versie	978-1-943580-30-9
DOI's	https://doi.org/10.1364/IPRSN.2017.IW3A.1
Status	Gepubliceerd - 1 jan 2017
Evenement	Advanced Photonics, IPRSN 2017 - New Orleans, Verenigde Staten van Amerika Duur: 24 jul 2017 → 27 jul 2017

Congres

Congres	Advanced Photonics, IPRSN 2017
Land	Verenigde Staten van Amerika
Stad	New Orleans
Periode	24/07/17 → 27/07/17

Toegang tot document

10.1364/IPRSN.2017.IW3A.1

Link to publication in Scopus

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abstract = "As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.",

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