TY - BOOK
T1 - Proceedings of the Eight International Conference on Tangible, Embedded and Embodied Interaction (TEI'14), Munich, Germany, February 16-19, 2014
A2 - Butz, A.
A2 - Greenberg, S.
A2 - Bakker, S.
A2 - Loke, L.
A2 - de Luca, A.
PY - 2014
Y1 - 2014
N2 - The work presented at ACM TEI has a strong focus on how computing can bridge atoms, bits and our surrounding everyday environment into cohesive interactive systems. What is surprising is that this focus was considered quite esoteric in 2007, the date of the first TEI conference. This has changed remarkably quickly. Creating such interactive systems has become easier through advances in materials, 3d printing, easy-to-program microcomputers, high-quality sensors and actuators, and specialized toolkits. More importantly, our culture has changed its perspective, where people no longer consider it unusual for computation to be embedded in our environment, surroundings, and everyday objects.
AB - The work presented at ACM TEI has a strong focus on how computing can bridge atoms, bits and our surrounding everyday environment into cohesive interactive systems. What is surprising is that this focus was considered quite esoteric in 2007, the date of the first TEI conference. This has changed remarkably quickly. Creating such interactive systems has become easier through advances in materials, 3d printing, easy-to-program microcomputers, high-quality sensors and actuators, and specialized toolkits. More importantly, our culture has changed its perspective, where people no longer consider it unusual for computation to be embedded in our environment, surroundings, and everyday objects.
UR - http://www.tei-conf.org/14/
M3 - Book editing
SN - 978-1-4503-2635-3
BT - Proceedings of the Eight International Conference on Tangible, Embedded and Embodied Interaction (TEI'14), Munich, Germany, February 16-19, 2014
PB - Association for Computing Machinery, Inc
CY - New York
ER -