Probing device for testing integrated circuits

The present invention is related to a probing device for electrical testing of ICs, comprising a semiconductor substrate and an anisotropically conducting contactor attached to the substrate. The substrate comprises an integrated circuit portion comprising an array of contact pads on the surface of the substrate. The contactor is attached to the array of pads and comprises an array of probes, each probe being in contact with one pad. The IC portion comprises circuitry for selecting a number of probes and connecting the selected probes to an I/O terminal of the device, for connection to test equipment. According to a particular embodiment, the anisotropically conducting contactor comprises a multitude of nano-scaled conductors embedded in an insulating matrix, so that each probe is formed by a plurality of nano-scaled conductors.