Prediction of thermo-mechanical integrity of wafer backend processes

V. Gonda, J.M.J. Toonder, den, J.G.J. Beijer, G.Q. Zhang, R.J.O.M. Hoofman, L.J. Ernst

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

More than 65% of IC failures are related to thermal and mechanical problems. For wafer backend processes, thermo-mechanical failure is one of the major bottlenecks. The ongoing technological trends like miniaturization, introduction of new materials, and function/product integration will increase the importance of thermomechanical reliability, as confirmed by the ITRS (International Technology Roadmap for Semiconductors [1]). since most of the thermomechnaical problems inititate in the design phase, failure prevention - designing for reliability, is strongly desired. To support wafer backend process development, it is necessary to develop reliable and efficient methodologies (both testing and modeling) to predict the thermal and mechnical behavior of backend processes. This paper presents our research results covering the backend process reliability modeling considering both thermal and mechanical (CMP) loading. The emphasis is particularly on the effect of using Cu/SiLK low-dielectric-constant (low-k) structure instead of the traditional Al/SiO2. SiLK is a particular polymeric low-k material developed by the Dow Chemical Company [2]. Our results shows that Cu/SiLK structures exhibit significantly different reliability characteristics than their aluminum predecessors, and that they are more critical from several design aspects. This not only makes the stress management in the stacks more difficult, but also strongly impacts packaging.
Originele taal-2Engels
TitelProceedings of the 4th International Conference on Thermal and Mechanical Simulation and Experiment in Microelectronics and Microsystems
RedacteurenL.J. Ernst
Plaats van productieFrance, Aix-en-Provence
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's359-363
ISBN van geprinte versie0-7803-7054-6
StatusGepubliceerd - 2003
Evenement4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2003) - Aix-en-Provence, Frankrijk
Duur: 30 mrt. 20032 apr. 2003
Congresnummer: 4
http://www.eurosime.org/b03.htm

Congres

Congres4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2003)
Verkorte titelEuroSimE 2003
Land/RegioFrankrijk
StadAix-en-Provence
Periode30/03/032/04/03
Ander4th International Conference on Thermal & Mechanical Simulations and Experiments in Micro-Electronics and Micro-Systems, EuroSIME 2003
Internet adres

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