Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

G.Q. Zhang; C.J. Liu; W.D. van Driel; R. Silfhout; M. van Gils

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

G.Q. Zhang, C.J. Liu, W.D. van Driel, R. Silfhout, M. van Gils

Mechanics of Materials

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

Originele taal-2	Engels
Titel	Proceedings of the conference EuroSimE 2003
Redacteuren	L.J. Ernst
Plaats van productie	Piscataway
Uitgeverij	Institute of Electrical and Electronics Engineers
Pagina's	337-343
ISBN van geprinte versie	0-7803-7054-6
Status	Gepubliceerd - 2003
Evenement	4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Aix-en-Provence, Frankrijk Duur: 30 mrt. 2003 → 2 apr. 2003

Congres

Congres	4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Land/Regio	Frankrijk
Stad	Aix-en-Provence
Periode	30/03/03 → 2/04/03

Citeer dit

@inproceedings{ab96d1f42e964f709bf888f73aa71fb2,

title = "Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods",

author = "G.Q. Zhang and C.J. Liu and {van Driel}, W.D. and R. Silfhout and {van Gils}, M.",

year = "2003",

language = "English",

isbn = "0-7803-7054-6",

pages = "337--343",

editor = "L.J. Ernst",

booktitle = "Proceedings of the conference EuroSimE 2003",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 30-03-2003 Through 02-04-2003",

}

Zhang, GQ, Liu, CJ, van Driel, WD, Silfhout, R & van Gils, M 2003, Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. in LJ Ernst (uitgave), Proceedings of the conference EuroSimE 2003. Institute of Electrical and Electronics Engineers, Piscataway, blz. 337-343, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Aix-en-Provence, Frankrijk, 30/03/03.

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. / Zhang, G.Q.; Liu, C.J.; van Driel, W.D. et al.
Proceedings of the conference EuroSimE 2003. uitgave / L.J. Ernst. Piscataway: Institute of Electrical and Electronics Engineers, 2003. blz. 337-343.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

AU - Zhang, G.Q.

AU - Liu, C.J.

AU - van Driel, W.D.

AU - Silfhout, R.

AU - van Gils, M.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 337

EP - 343

BT - Proceedings of the conference EuroSimE 2003

A2 - Ernst, L.J.

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

Y2 - 30 March 2003 through 2 April 2003

ER -