Power semiconductor device adaptive cooling assembly

A.C. de Rijck (Uitvinder), H. Huisman (Uitvinder)

Onderzoeksoutput: OctrooiOctrooi-publicatie

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Samenvatting

The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).
Originele taal-2Engels
OctrooinummerEP2335280
IPCH01L 23/ 34 A I
Prioriteitsdatum1/10/09
StatusGepubliceerd - 22 jun 2011

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