Position control in lithographic equipment

H. Butler; W. Simons

Position control in lithographic equipment

H. Butler, W. Simons

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

13 Citaten (Scopus)

21 Downloads (Pure)

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In IC manufacturing, lithographic scanners expose a circuit pattern onto a semiconductor wafer by means of an optical system. The stage holding the wafer must have a scanning position accuracy of only a few nanometers to support imaging and overlay requirements. In the past 10 years, stage acceleration, position error and settling time have all improved 5-8 times. Compared to lithographic steppers of 25 years ago, the number of controlled stage axes has grown from 3 (analog) to 50 (high-speed digital).

Originele taal-2	Engels
Titel	Proceedings of the ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21-23 April 2013, Cambridge, Massachusetts
Plaats van productie	Raleigh
Uitgeverij	American Society of Precision Engineering (ASPE)
Pagina's	7-12
Status	Gepubliceerd - 2013
Evenement	ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit - Duur: 21 apr. 2013 → 23 apr. 2013

Congres

Congres	ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit
Periode	21/04/13 → 23/04/13
Ander	ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit

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@inproceedings{b8856030e9be4472ac0491a4887241a7,

title = "Position control in lithographic equipment",

abstract = "In IC manufacturing, lithographic scanners expose a circuit pattern onto a semiconductor wafer by means of an optical system. The stage holding the wafer must have a scanning position accuracy of only a few nanometers to support imaging and overlay requirements. In the past 10 years, stage acceleration, position error and settling time have all improved 5-8 times. Compared to lithographic steppers of 25 years ago, the number of controlled stage axes has grown from 3 (analog) to 50 (high-speed digital).",

author = "H. Butler and W. Simons",

year = "2013",

language = "English",

pages = "7--12",

booktitle = "Proceedings of the ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21-23 April 2013, Cambridge, Massachusetts",

publisher = "American Society of Precision Engineering (ASPE)",

note = "ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit ; Conference date: 21-04-2013 Through 23-04-2013",

}

Butler, H & Simons, W 2013, Position control in lithographic equipment. in Proceedings of the ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21-23 April 2013, Cambridge, Massachusetts. American Society of Precision Engineering (ASPE), Raleigh, blz. 7-12, ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21/04/13.

Position control in lithographic equipment. / Butler, H.; Simons, W.
Proceedings of the ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21-23 April 2013, Cambridge, Massachusetts. Raleigh: American Society of Precision Engineering (ASPE), 2013. blz. 7-12.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Position control in lithographic equipment

AU - Butler, H.

AU - Simons, W.

PY - 2013

Y1 - 2013

N2 - In IC manufacturing, lithographic scanners expose a circuit pattern onto a semiconductor wafer by means of an optical system. The stage holding the wafer must have a scanning position accuracy of only a few nanometers to support imaging and overlay requirements. In the past 10 years, stage acceleration, position error and settling time have all improved 5-8 times. Compared to lithographic steppers of 25 years ago, the number of controlled stage axes has grown from 3 (analog) to 50 (high-speed digital).

AB - In IC manufacturing, lithographic scanners expose a circuit pattern onto a semiconductor wafer by means of an optical system. The stage holding the wafer must have a scanning position accuracy of only a few nanometers to support imaging and overlay requirements. In the past 10 years, stage acceleration, position error and settling time have all improved 5-8 times. Compared to lithographic steppers of 25 years ago, the number of controlled stage axes has grown from 3 (analog) to 50 (high-speed digital).

M3 - Conference contribution

SP - 7

EP - 12

BT - Proceedings of the ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21-23 April 2013, Cambridge, Massachusetts

PB - American Society of Precision Engineering (ASPE)

CY - Raleigh

T2 - ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit

Y2 - 21 April 2013 through 23 April 2013

ER -

Position control in lithographic equipment

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Congres

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