Photonic hybrid assembly through flexible waveguides

K. Wörhoff, A. Prak, F. Postma, A. Leinse, Kai Wu, T. J. Peters, M. Tichem, B. Amaning-Appiah, V. Renukappa, G. Vollrath, J. Balcells-Ventura, P. Uhlig, M. Seyfried, D. Rose, R. Santos, X.J.M. Leijtens, B. Flintham, M. Wale, D. Robbins

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.

Originele taal-2Engels
TitelSilicon Photonics and Photonic Integrated Circuits V, 3-7 April 2016, Brussels, Belgium
Plaats van productieBellingham
ISBN van elektronische versie9781510601369
StatusGepubliceerd - 2016
EvenementSilicon Photonics and Photonic Integrated Circuits V - Brussels, België
Duur: 3 apr 20167 apr 2016

Publicatie series

NaamProceedings of SPIE


CongresSilicon Photonics and Photonic Integrated Circuits V

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  • Citeer dit

    Wörhoff, K., Prak, A., Postma, F., Leinse, A., Wu, K., Peters, T. J., Tichem, M., Amaning-Appiah, B., Renukappa, V., Vollrath, G., Balcells-Ventura, J., Uhlig, P., Seyfried, M., Rose, D., Santos, R., Leijtens, X. J. M., Flintham, B., Wale, M., & Robbins, D. (2016). Photonic hybrid assembly through flexible waveguides. In Silicon Photonics and Photonic Integrated Circuits V, 3-7 April 2016, Brussels, Belgium [98911P] (Proceedings of SPIE; Vol. 9891). SPIE.