Performance improvement in wafer separation machines

Onderzoeksoutput: ScriptiePd Eng Thesis

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This document is a report of a one year PDEng project performed in ASM Laser Separation International (ALSI) in collaboration with the Eindhoven University of Technology (TU/e). The aim of this project was to improve the performance of the wafer separation quality in specific by improving the performance of the planar motor system of the wafer dicing machine. In this project different improvement designs were proposed and evaluated using system engineering methods. The selected designs were implemented and tested. The tests showed considerable improvement in the accuracy of the wafer dicing process. Further more the design results improvement in machine reliability and reduces the downtime of the machine.
Originele taal-2Engels
Toekennende instantie
Begeleider(s)/adviseur
  • Heertjes, Marcel F., Begeleider
  • Noijen, R.P.F., Externe begeleider
  • Aneke, N.P.I., Externe begeleider
Datum van toekenning31 okt 2017
Plaats van publicatieEindhoven
Uitgever
StatusGepubliceerd - 31 okt 2017

Vingerafdruk

Systems engineering
Lasers

Bibliografische nota

PDEng thesis. - Confidential for ever.

Citeer dit

Roomi Zadeh, A. (2017). Performance improvement in wafer separation machines. Eindhoven: Technische Universiteit Eindhoven.
Roomi Zadeh, A.. / Performance improvement in wafer separation machines. Eindhoven : Technische Universiteit Eindhoven, 2017.
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Performance improvement in wafer separation machines. / Roomi Zadeh, A.

Eindhoven : Technische Universiteit Eindhoven, 2017.

Onderzoeksoutput: ScriptiePd Eng Thesis

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N2 - This document is a report of a one year PDEng project performed in ASM Laser Separation International (ALSI) in collaboration with the Eindhoven University of Technology (TU/e). The aim of this project was to improve the performance of the wafer separation quality in specific by improving the performance of the planar motor system of the wafer dicing machine. In this project different improvement designs were proposed and evaluated using system engineering methods. The selected designs were implemented and tested. The tests showed considerable improvement in the accuracy of the wafer dicing process. Further more the design results improvement in machine reliability and reduces the downtime of the machine.

AB - This document is a report of a one year PDEng project performed in ASM Laser Separation International (ALSI) in collaboration with the Eindhoven University of Technology (TU/e). The aim of this project was to improve the performance of the wafer separation quality in specific by improving the performance of the planar motor system of the wafer dicing machine. In this project different improvement designs were proposed and evaluated using system engineering methods. The selected designs were implemented and tested. The tests showed considerable improvement in the accuracy of the wafer dicing process. Further more the design results improvement in machine reliability and reduces the downtime of the machine.

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Roomi Zadeh A. Performance improvement in wafer separation machines. Eindhoven: Technische Universiteit Eindhoven, 2017. (PDEng rapport).