Samenvatting
This paper presents a comparison between different silicon (Si) substrates used in Si-based IC technologies at E-Band (71–86 GHz). A unique low-loss and compact contactless transition from a silicon IC (p-doped substrate) to a metal waveguide is used. The proposed transition incorporates a spatial power combiner to enable direct electromagnetic coupling from an array of patches on the IC to a metal waveguide. This design enables a high-power transition from an IC to a waveguide and/or antenna at millimeter-wave (mm-wave) frequencies, where a galvanic contact between the two parts is avoided.
Originele taal-2 | Engels |
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Titel | 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2019 - Proceedings |
Plaats van productie | Piscataway |
Uitgeverij | Institute of Electrical and Electronics Engineers |
Pagina's | 1081-1082 |
Aantal pagina's | 2 |
ISBN van elektronische versie | 978-1-7281-0692-2 |
DOI's | |
Status | Gepubliceerd - 31 okt. 2019 |
Evenement | 2019 IEEE International Symposium on Antennas and Propagation and USNC/URSI National Radio Science Meeting, APSURSI 2019 - Atlanta, Verenigde Staten van Amerika Duur: 7 jul. 2019 → 12 jul. 2019 https://www.2019apsursi.org/ |
Congres
Congres | 2019 IEEE International Symposium on Antennas and Propagation and USNC/URSI National Radio Science Meeting, APSURSI 2019 |
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Verkorte titel | APSURSI 2019 |
Land/Regio | Verenigde Staten van Amerika |
Stad | Atlanta |
Periode | 7/07/19 → 12/07/19 |
Internet adres |