Optimisation of photoresist removal from silicon wafers using atmospheric-pressure plasma jet effluent

A.T. West, M. Schans, van der, C. Xu, T. Gans, M. Cooke, E. Wagenaars

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademic

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Samenvatting

Atmospheric-pressure plasma jets (APPJs) can offer high-quality etch of photoresist at rates up to 10 µm/min, compared to 10 - 100 nm/min using traditional low-pressure methods, while avoiding the inconveniences of operating vacuum systems. We determined that the removal rate of photoresist is strongly linked with the flux of atomic oxygen in the APPJ effluent as measured using laser-based diagnostics (TALIF).
Originele taal-2Engels
TitelProceedings of the 22nd International Symposium on Plasma Chemistry, 5-10 July 2015, Antwerp, Belgium
Pagina's1-4
Aantal pagina's4
StatusGepubliceerd - 2015
Evenement22nd International Symposuium on Plasma Chemistry (ISPC 2015), 5-10 July 2015, Antwerp, Belgium - Antwerp, België
Duur: 5 jul 201510 jul 2015
https://www.uantwerpen.be/en/conferences/ispc22/

Congres

Congres22nd International Symposuium on Plasma Chemistry (ISPC 2015), 5-10 July 2015, Antwerp, Belgium
Verkorte titelISPC 22
LandBelgië
StadAntwerp
Periode5/07/1510/07/15
Ander22nd International Symposium on Plasma Chemistry, July 5-10, 2015 Antwerp, Belgium
Internet adres

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