Optimal actuator shape design with input and state constraints for a wafer heating application

D.W.M. Veldman, R.H.B. Fey, H.J. Zwart, M.M.J. van de Wal, J.D.B.J. van den Boom, H. Nijmeijer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

Originele taal-2Engels
Titel2019 American Control Conference, ACC 2019
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's6
ISBN van elektronische versie978-1-5386-7926-5
StatusGepubliceerd - 1 jul. 2019
Evenement2019 American Control Conference (ACC 2019) - Philadelphia, Verenigde Staten van Amerika
Duur: 10 jul. 201912 jul. 2019


Congres2019 American Control Conference (ACC 2019)
Verkorte titelACC2019
Land/RegioVerenigde Staten van Amerika
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