Uittreksel
Test, assembly and packaging processes substantially contribute to the overall production cost of photonic integrated circuits. Implementation of test processes across the full production chain is critical in order to deliver statistically significant data sets. These will allow for optimization of the fabrication process widows, early known-good-die selection, improved models in design tools and lead to improved yield, reduced cost and scalability which will open a path to volume production. Progress on developments of open access test infrastructure at our laboratories and open standard test framework will be presented.
| Originele taal-2 | Engels |
|---|---|
| Titel | 21st International Conference on Transparent Optical Networks, ICTON 2019 |
| Plaats van productie | Piscataway |
| Uitgeverij | IEEE Computer Society |
| Aantal pagina's | 4 |
| ISBN van elektronische versie | 9781728127798 |
| DOI's | |
| Status | Gepubliceerd - 1 jul 2019 |
| Evenement | 21st International Conference on Transparent Optical Networks, ICTON 2019 - Angers, Frankrijk Duur: 9 jul 2019 → 13 jul 2019 http://www.icton2019.com/index.php |
Congres
| Congres | 21st International Conference on Transparent Optical Networks, ICTON 2019 |
|---|---|
| Verkorte titel | ICTON2019 |
| Land | Frankrijk |
| Stad | Angers |
| Periode | 9/07/19 → 13/07/19 |
| Internet adres |
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Open standard test framework for photonic integrated circuits. / Latkowski, Sylwester; Pustakhod, Dzmitry; Chatzimichailidis, Michail; Leijtens, Xaveer; Williams, Kevin.
21st International Conference on Transparent Optical Networks, ICTON 2019. Piscataway : IEEE Computer Society, 2019. Sa.A5.4 .Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review
TY - GEN
T1 - Open standard test framework for photonic integrated circuits
AU - Latkowski, Sylwester
AU - Pustakhod, Dzmitry
AU - Chatzimichailidis, Michail
AU - Leijtens, Xaveer
AU - Williams, Kevin
PY - 2019/7/1
Y1 - 2019/7/1
N2 - Test, assembly and packaging processes substantially contribute to the overall production cost of photonic integrated circuits. Implementation of test processes across the full production chain is critical in order to deliver statistically significant data sets. These will allow for optimization of the fabrication process widows, early known-good-die selection, improved models in design tools and lead to improved yield, reduced cost and scalability which will open a path to volume production. Progress on developments of open access test infrastructure at our laboratories and open standard test framework will be presented.
AB - Test, assembly and packaging processes substantially contribute to the overall production cost of photonic integrated circuits. Implementation of test processes across the full production chain is critical in order to deliver statistically significant data sets. These will allow for optimization of the fabrication process widows, early known-good-die selection, improved models in design tools and lead to improved yield, reduced cost and scalability which will open a path to volume production. Progress on developments of open access test infrastructure at our laboratories and open standard test framework will be presented.
KW - Integrated photonics
KW - Photonic integrated circuits
KW - Photonic integration
KW - Test
KW - Test automation
UR - http://www.scopus.com/inward/record.url?scp=85073059411&partnerID=8YFLogxK
U2 - 10.1109/ICTON.2019.8840336
DO - 10.1109/ICTON.2019.8840336
M3 - Conference contribution
AN - SCOPUS:85073059411
BT - 21st International Conference on Transparent Optical Networks, ICTON 2019
PB - IEEE Computer Society
CY - Piscataway
ER -