Open standard test framework for photonic integrated circuits

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

Test, assembly and packaging processes substantially contribute to the overall production cost of photonic integrated circuits. Implementation of test processes across the full production chain is critical in order to deliver statistically significant data sets. These will allow for optimization of the fabrication process widows, early known-good-die selection, improved models in design tools and lead to improved yield, reduced cost and scalability which will open a path to volume production. Progress on developments of open access test infrastructure at our laboratories and open standard test framework will be presented.

Originele taal-2Engels
Titel21st International Conference on Transparent Optical Networks, ICTON 2019
Plaats van productiePiscataway
UitgeverijIEEE Computer Society
Aantal pagina's4
ISBN van elektronische versie9781728127798
DOI's
StatusGepubliceerd - 1 jul 2019
Evenement21st International Conference on Transparent Optical Networks, ICTON 2019 - Angers, Frankrijk
Duur: 9 jul 201913 jul 2019
http://www.icton2019.com/index.php

Congres

Congres21st International Conference on Transparent Optical Networks, ICTON 2019
Verkorte titelICTON2019
LandFrankrijk
StadAngers
Periode9/07/1913/07/19
Internet adres

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Citeer dit

Latkowski, S., Pustakhod, D., Chatzimichailidis, M., Leijtens, X., & Williams, K. (2019). Open standard test framework for photonic integrated circuits. In 21st International Conference on Transparent Optical Networks, ICTON 2019 [Sa.A5.4 ] Piscataway: IEEE Computer Society. https://doi.org/10.1109/ICTON.2019.8840336