Open standard test framework for photonic integrated circuits

Test, assembly and packaging processes substantially contribute to the overall production cost of photonic integrated circuits. Implementation of test processes across the full production chain is critical in order to deliver statistically significant data sets. These will allow for optimization of the fabrication process widows, early known-good-die selection, improved models in design tools and lead to improved yield, reduced cost and scalability which will open a path to volume production. Progress on developments of open access test infrastructure at our laboratories and open standard test framework will be presented.