On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits

G. Gilardi; W. Yao; M.K. Smit; M.J. Wale

doi:10.1364/IPRSN.2014.IM3A.1

On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits

G. Gilardi, W. Yao, M.K. Smit, M.J. Wale

Photonic Integration

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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We fabricated deep trenches to modify the heat transfer path coming from active components. Current injected in active components and trenches geometry are the parameters considered. We demonstrate how the trenches reduce the thermal crosstalk.

Originele taal-2	Engels
Titel	Conference Paper Integrated Photonics Research, Silicon and Nanophotonics, San Diego, California United States, July 13-17, 2014
Uitgeverij	Optical Society of America (OSA)
ISBN van geprinte versie	978-1-55752-737-0
DOI's	https://doi.org/10.1364/IPRSN.2014.IM3A.1
Status	Gepubliceerd - 2014

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10.1364/IPRSN.2014.IM3A.1

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@inproceedings{6f4dd8019f434b7fbe7013bc76a84e80,

title = "On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits",

abstract = "We fabricated deep trenches to modify the heat transfer path coming from active components. Current injected in active components and trenches geometry are the parameters considered. We demonstrate how the trenches reduce the thermal crosstalk.",

author = "G. Gilardi and W. Yao and M.K. Smit and M.J. Wale",

year = "2014",

doi = "10.1364/IPRSN.2014.IM3A.1",

language = "English",

isbn = "978-1-55752-737-0",

booktitle = "Conference Paper Integrated Photonics Research, Silicon and Nanophotonics, San Diego, California United States, July 13-17, 2014",

publisher = "Optical Society of America (OSA)",

address = "United States",

}

On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits. / Gilardi, G.; Yao, W.; Smit, M.K. et al.
Conference Paper Integrated Photonics Research, Silicon and Nanophotonics, San Diego, California United States, July 13-17, 2014. Optical Society of America (OSA), 2014.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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T1 - On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits

AU - Gilardi, G.

AU - Yao, W.

AU - Smit, M.K.

AU - Wale, M.J.

PY - 2014

Y1 - 2014

N2 - We fabricated deep trenches to modify the heat transfer path coming from active components. Current injected in active components and trenches geometry are the parameters considered. We demonstrate how the trenches reduce the thermal crosstalk.

AB - We fabricated deep trenches to modify the heat transfer path coming from active components. Current injected in active components and trenches geometry are the parameters considered. We demonstrate how the trenches reduce the thermal crosstalk.

U2 - 10.1364/IPRSN.2014.IM3A.1

DO - 10.1364/IPRSN.2014.IM3A.1

M3 - Conference contribution

SN - 978-1-55752-737-0

BT - Conference Paper Integrated Photonics Research, Silicon and Nanophotonics, San Diego, California United States, July 13-17, 2014

PB - Optical Society of America (OSA)

ER -

On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits

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