Debonding of polymermetal interfaces often involves both interfacial and cohesive failure. This paperextends the investigation of Yao and Qu presented in [Yao Q, Qu J. Interfacial versus cohesive failureon polymermetal interfaces in electronic packaging effects of interface roughness. J Electr Packag2002;124;12734] towards a numerical fracture mechanics model that is used to quantitatively predictthe relation between cohesive and adhesive failure on a metalpolymer interface. As example, an epoxyaluminum interface is investigated. The competition between adhesive and cohesive failure dependingon surface roughness parameters will be studied. Understanding of these phenomena could enable theoptimization of interface properties for different applications.
|Tijdschrift||Microelectronics and Reliability : an International Journal and World Abstracting Service|
|Nummer van het tijdschrift||9-11|
|Status||Gepubliceerd - 2009|