Novel image correlation based techniques for mechanical analysis of MEMS

S.M. Kleinendorst, R.R.M. Borger, J.P.M. Hoefnagels, M.G.D. Geers

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

Three techniques have been developed to analyze the mechanical behavior of micromechanical systems, in particular stretchable electronic interconnects. The techniques are all digital image correlation (DIC) based and vary in the type of images used for correlation and the way of regularizing the displacement field, needed because of the ill-posed nature of DIC problems. The first two techniques use Non-Uniform Rational B-Splines (NURBS) which are adaptively refined to autonomously obtain an optimized set of shape functions for the considered problem. The first method applies this to regular grayscale speckle images, while the second technique requires profilometric height images to calculate not only the in-plane deformation, but also the out-of-plane component of the displacement field. The third method is an integrated DIC approach and is coupled to a finite element (FE) model of the sample for regularization of the displacement field. It correlates projections of the sample contour rather than a speckle pattern, which makes the method suitable for large, complex and three-dimensional displacements and cases where speckle pattern application is difficult, such as microscale samples. Application of the techniques to i.a. stretchable electronic interconnects yields good results.

Originele taal-2Engels
TitelMicro and nanomechanics
RedacteurenL. Starman, J. Hay
Plaats van productieCham
UitgeverijSpringer
Pagina's19-28
Aantal pagina's10
ISBN van elektronische versie978-3-319-63405-0
ISBN van geprinte versie978-3-319-63404-3
DOI's
StatusGepubliceerd - 2018
Evenement2017 Annual Conference and Exposition on Experimental and Applied Mechanics - Indianapolis, Verenigde Staten van Amerika
Duur: 12 jun 201715 jun 2017

Publicatie series

NaamConference Proceedings of the Society for Experimental Mechanics Series
UitgeverijSpringer
Nummer5

Congres

Congres2017 Annual Conference and Exposition on Experimental and Applied Mechanics
Land/RegioVerenigde Staten van Amerika
StadIndianapolis
Periode12/06/1715/06/17

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