Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication

P. Duan, O. Raz, H.J.S. Dorren

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Originele taal-2Engels
UitgeverInstitute of Electrical and Electronics Engineers
Plaats van productiePiscataway
StatusGepubliceerd - 2013

Citeer dit

Duan, P., Raz, O., & Dorren, H. J. S. (2013). Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication. Piscataway: Institute of Electrical and Electronics Engineers.
Duan, P. ; Raz, O. ; Dorren, H.J.S. / Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication. 2013. Piscataway : Institute of Electrical and Electronics Engineers.
@misc{34daa3aa3e2f4113aa9b875b8cac9c10,
title = "Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication",
author = "P. Duan and O. Raz and H.J.S. Dorren",
year = "2013",
language = "English",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
type = "Other",

}

Duan, P, Raz, O & Dorren, HJS 2013, Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication. Institute of Electrical and Electronics Engineers, Piscataway.

Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication. / Duan, P.; Raz, O.; Dorren, H.J.S.

Piscataway : Institute of Electrical and Electronics Engineers. 2013, .

Onderzoeksoutput: Andere bijdrageOverige bijdrageAndere onderzoeksoutput

TY - GEN

T1 - Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication

AU - Duan, P.

AU - Raz, O.

AU - Dorren, H.J.S.

PY - 2013

Y1 - 2013

M3 - Other contribution

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -