Novel 3D die-stacked opto-electronic transceiver ICs that allow for wafer-scale fabrication: application in switches and router

P. Duan, O. Raz, Barry E. Smalbrugge, H.J.S. Dorren

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Originele taal-2Engels
TitelProceedings of the 18th Microoptics Conference (MOC 2013), 27-30 October 2013, Tokyo, Japan
Pagina's1-2
StatusGepubliceerd - 2013

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