Multi-scale analysis of solder interconnects in micro-electronics

M.G.D. Geers, M.E. Erinc, M.A. Matin

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention is given on the most dominant interfacial damage mechanisms and related numerical methods that enable life time predictions in thermo-mechanical cycling.
Originele taal-2Engels
TitelEuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's1-6
ISBN van geprinte versie9781-424441617
DOI's
StatusGepubliceerd - 2009
Evenement10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009) - Delft, Nederland
Duur: 26 apr 200929 apr 2009
Congresnummer: 10
http://www.eurosime.org/b09.htm

Congres

Congres10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009)
Verkorte titelEuroSimE 2009
LandNederland
StadDelft
Periode26/04/0929/04/09
AnderEuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands
Internet adres

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