Uittreksel
| Taal | Engels |
|---|---|
| Artikelnummer | 6100711 |
| Aantal pagina's | 11 |
| Tijdschrift | IEEE Journal of Selected Topics in Quantum Electronics |
| Volume | 24 |
| Nummer van het tijdschrift | 1 |
| Vroegere onlinedatum | 12 okt 2017 |
| DOI's | |
| Status | Gepubliceerd - 1 jan 2018 |
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Monolithic 300 Gb/s parallel transmitter in InP based generic photonic integration technology. / Yao, W.; Smit, M.K.; Wale, M.J.
In: IEEE Journal of Selected Topics in Quantum Electronics, Vol. 24, Nr. 1, 6100711, 01.01.2018.Onderzoeksoutput: Bijdrage aan tijdschrift › Tijdschriftartikel › Academic › peer review
TY - JOUR
T1 - Monolithic 300 Gb/s parallel transmitter in InP based generic photonic integration technology
AU - Yao,W.
AU - Smit,M.K.
AU - Wale,M.J.
PY - 2018/1/1
Y1 - 2018/1/1
N2 - In order to meet the constantly rising traffic demands in optical transport systems for data and telecommunications, compact, power efficient and low cost optical transmitters are needed that offer easy scalability towards higher transmission capacities. Photonic integrated circuit (PIC) technology based on the InP material has long enabled the monolithic integration of tunable sources with modulators and opened the way towards large-scale wavelength-division multiplexed (WDM) parallel transmitters. In this paper, we present the design and performance of a monolithic tunable 8 x 40 Gb/s parallel transmitter chip with more than 220 components and state-of-the-art capacity density metric. A generic photonic integration approach was followed, in which the transmitter is constituted from welldeveloped subcircuits and building blocks (BB), facilitating its design and manufacturing. With the trend towards large-scale integration with increasing component densities and smaller chip sizes, proximity effects in form of crosstalk are limiting further miniaturization efforts. We analyze electrical, thermal and optical crosstalk effects that are relevant to the transmitter design, discuss appropriate mitigation techniques and indicate the limitations of the current technology.
AB - In order to meet the constantly rising traffic demands in optical transport systems for data and telecommunications, compact, power efficient and low cost optical transmitters are needed that offer easy scalability towards higher transmission capacities. Photonic integrated circuit (PIC) technology based on the InP material has long enabled the monolithic integration of tunable sources with modulators and opened the way towards large-scale wavelength-division multiplexed (WDM) parallel transmitters. In this paper, we present the design and performance of a monolithic tunable 8 x 40 Gb/s parallel transmitter chip with more than 220 components and state-of-the-art capacity density metric. A generic photonic integration approach was followed, in which the transmitter is constituted from welldeveloped subcircuits and building blocks (BB), facilitating its design and manufacturing. With the trend towards large-scale integration with increasing component densities and smaller chip sizes, proximity effects in form of crosstalk are limiting further miniaturization efforts. We analyze electrical, thermal and optical crosstalk effects that are relevant to the transmitter design, discuss appropriate mitigation techniques and indicate the limitations of the current technology.
U2 - 10.1109/JSTQE.2017.2762602
DO - 10.1109/JSTQE.2017.2762602
M3 - Article
VL - 24
JO - IEEE Journal of Selected Topics in Quantum Electronics
T2 - IEEE Journal of Selected Topics in Quantum Electronics
JF - IEEE Journal of Selected Topics in Quantum Electronics
SN - 1077-260X
IS - 1
M1 - 6100711
ER -