Moisture diffusion model verification of packaging materials

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang, C. Regard, C. Gautier, H. Fremont

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

9 Citaten (Scopus)

Samenvatting

The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.
Originele taal-2Engels
TitelInternational Conference on Electronics Packaging Technology & High Density Packaging, 2008 (ICEPT-HDP 2008), Shanghai, China, 28 - 31 July 2008
RedacteurenK. Bi
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's636-640
ISBN van geprinte versie978-1-4244-2739-0
DOI's
StatusGepubliceerd - 2008
Evenement2008 International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2008) - Shanghai, China
Duur: 28 jul 200831 jul 2008

Congres

Congres2008 International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2008)
Verkorte titelICEPT-HDP 2008
Land/RegioChina
StadShanghai
Periode28/07/0831/07/08

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