Modeling of a direct transition from IC-package to waveguide

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

New applications like 5G and car radar require higher operating frequencies. For higher frequencies the size of a typical packaged IC is of the same order of magnitude of one or more waveguide cross-sections, giving the opportunity to use the waveguide as an IC to waveguide interconnect. The excitation of an in-package waveguide needs to be modeled to design the interconnect. This paper shows that a simplified Method Of Moments (MOM) model is suitable for modeling a dipole excitation. Results for the MOM model shows good comparison with CST and an analytical model. Furthermore, the MOM model is converted into a circuit model for a direct integration with IC design tools.
Originele taal-2Engels
Titel2018 IEEE International Symposium on Antennas and Propagation USNC/URSI National Radio Science Meeting
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's2369-2370
Aantal pagina's2
ISBN van elektronische versie978-1-5386-7102-3
ISBN van geprinte versie978-1-5386-7103-0
DOI's
StatusGepubliceerd - 10 jan 2019
Evenement2018 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting, APSURSI 2018 - Boston, Verenigde Staten van Amerika
Duur: 8 jul 201813 jul 2018

Congres

Congres2018 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting, APSURSI 2018
LandVerenigde Staten van Amerika
StadBoston
Periode8/07/1813/07/18

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  • Citeer dit

    Geluk, S. J., de Hon, B. P., & Smolders, A. B. (2019). Modeling of a direct transition from IC-package to waveguide. In 2018 IEEE International Symposium on Antennas and Propagation USNC/URSI National Radio Science Meeting (blz. 2369-2370). [8608660] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/APUSNCURSINRSM.2018.8608660