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| Originele taal-2 | Engels |
|---|---|
| Pagina's (van-tot) | 1681-1684 |
| Tijdschrift | Microelectronic Engineering |
| Volume | 88 |
| Nummer van het tijdschrift | 8 |
| DOI's | |
| Status | Gepubliceerd - 2011 |
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Micromolding for ceramic microneedle arrays. / Bystrova, S.N.; Luttge, R.
In: Microelectronic Engineering, Vol. 88, Nr. 8, 2011, blz. 1681-1684.Onderzoeksoutput: Bijdrage aan tijdschrift › Tijdschriftartikel › Academic › peer review
TY - JOUR
T1 - Micromolding for ceramic microneedle arrays
AU - Bystrova, S.N.
AU - Luttge, R.
PY - 2011
Y1 - 2011
N2 - The fabrication process of ceramic microneedle arrays (MNAs) is presented. This includes the manufacturing of an SU-8/Si-master, its double replication resulting in a PDMS mold for production by micromolding and ceramic sintering. The robustness of the replicated structures was tested by means of microindentation techniques eliminating shear forces and by manual application of MNAs into silicone rubber. No damages of MNAs were observed using controlled microindentation. After the manual application, however, some microneedles were broken and left in the silicone. The opportunities and the ways to solve underlying problems of the fabrication process will be suggested and discussed. © 2011 Elsevier B.V. All rights reserved.
AB - The fabrication process of ceramic microneedle arrays (MNAs) is presented. This includes the manufacturing of an SU-8/Si-master, its double replication resulting in a PDMS mold for production by micromolding and ceramic sintering. The robustness of the replicated structures was tested by means of microindentation techniques eliminating shear forces and by manual application of MNAs into silicone rubber. No damages of MNAs were observed using controlled microindentation. After the manual application, however, some microneedles were broken and left in the silicone. The opportunities and the ways to solve underlying problems of the fabrication process will be suggested and discussed. © 2011 Elsevier B.V. All rights reserved.
U2 - 10.1016/j.mee.2010.12.067
DO - 10.1016/j.mee.2010.12.067
M3 - Article
VL - 88
SP - 1681
EP - 1684
JO - Microelectronic Engineering
JF - Microelectronic Engineering
SN - 0167-9317
IS - 8
ER -