Microfabrication of 3D terahertz circuitry

C.M. Mann, P.J.I. de Maagt, G. McBride, A.M. Water, van de, D. Castiglione, A. McCalden, L. Deias, J. O'Neill, A. Laisne, J.T. Vallinas, I. Ederra, D. Haskett, D. Jenkins, A. Zinn, M. Ferlet, R. Edeson

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

7 Citaten (Scopus)


Advances in micro-fabrication techniques combined with accurate simulation tools has provided the means for the realisation of complex terahertz circuitry. Silicon micro-machining provides the way forward to fabricate accurate rugged structures. Multi-level deep reactive ion etching can be used to replace traditional machining methods achieving smaller feature size, improved surface finish and greater freedom in circuit layout. Photonic Bandgap waveguides enable three dimensional arrangements of active devices antennae and filters, and removes the requirement for metallisation of adjoining surfaces. This paper describes some of the state of the art terahertz circuit design and realisation using these techniques.
Originele taal-2Engels
TitelIEEE MTT-S International Microwave Symposium Digest, 2003
Plaats van productiePiscataway, USA
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's4
ISBN van geprinte versie0-780376951
StatusGepubliceerd - 2003


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