Methods of depositing materials onto 2-dimensional layered materials

A method for plasma deposition of materials onto a two-dimensional (2D) layer 405 of a first substrate 401, the method comprising: depositing a protective layer 406 directly onto the 2D layer 405 in a pulsed plasma deposition process; and depositing a second layer 407 onto the protective layer 406 in a second plasma deposition process. The 2D layer 405 may comprise graphene. The protective layer 406 may be a dielectric, preferably a metal or semiconductor nitride, carbide or carbonitride. The pulsed plasma deposition process may be a plasma enhanced atomic layer deposition (PEALD) process, a pulsed plasma enhanced chemical vapour deposition (PPECVD) process or a radical enhanced atomic layer deposition (REALD) process, such as hot wire assisted atomic layer deposition.