Mass transfer to and copper deposition on a round bar in a new type of electrolytic cell: the helix cell

High-rate electrodeposition of copper from CuSO4-H2SO4 baths can be achieved by using crossflow of solution. To obtain copper layers of uniform thickness and quality, a new type of electrolytic cell, the helix cell, has been proposed. An experimental dimensionless relation has been given to describe the mass transfer to a round bar, in crossflow, in a helix cell. Moreover, the current efficiency of copper deposition has been obtained as a function of current density, flow rate of solution, temperature and weight per cent CuSO4 in the CuSO4-H2SO4 solution.