Samenvatting
The semiconductor industry has been driving a major part of its growth through first the PC and more recently the mobile market. Unfortunately, the PC market is in decline and also the end of the growth curve for mobile products is in sight now that virtually everyone on the planet has a smartphone and/or tablet. Hence, the semiconductor industry is putting its bets on 'Internet of Things' (IoT) as the next application wave that will allow them to sell a lot of silicon real estate. Although what exactly IoT encompasses is under definition and hence still volatile, the first emerging products depict an image which is quite different from the traditional microprocessors or smartphone SOCs: small but with ubiquitous presence, wirelessly connected, energy harvesting, equipped with smart sensors, secure, and low cost. All these aspects have a profound impact on the challenges, solutions, and associated trade-offs for testing IoT chips and provide rich grounds for research. This paper provides seven views from different angles.
| Originele taal-2 | Engels |
|---|---|
| Titel | Proceedings - 2016 21st IEEE European Test Symposium, ETS 2016 |
| Plaats van productie | Piscataway |
| Uitgeverij | Institute of Electrical and Electronics Engineers |
| Aantal pagina's | 10 |
| ISBN van elektronische versie | 9781467396592 |
| DOI's | |
| Status | Gepubliceerd - 22 mei 2016 |
| Evenement | 21st IEEE European Test Symposium (ETS 2016) - Amsterdam, Nederland Duur: 23 mei 2016 → 26 mei 2016 Congresnummer: 21 http://www.ets16.nl/ |
Congres
| Congres | 21st IEEE European Test Symposium (ETS 2016) |
|---|---|
| Verkorte titel | ETS 2016 |
| Land/Regio | Nederland |
| Stad | Amsterdam |
| Periode | 23/05/16 → 26/05/16 |
| Internet adres |
Vingerafdruk
Duik in de onderzoeksthema's van 'IoT: source of test challenges'. Samen vormen ze een unieke vingerafdruk.Citeer dit
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