Integrating advanced interconnect technologies in a high power lighting application : first steps

S.P.M. Noijen, S. Fritsche, A.S. Klein, A. Poppe, G Kums, O. Sluis, van der

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademic

1 Citaat (Scopus)

Samenvatting

This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.
Originele taal-2Engels
TitelProceedings of the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013), Berlin, 25-27 September, 2013
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's276-280
ISBN van geprinte versie978-1-4799-2271-0
DOI's
StatusGepubliceerd - 2013
Evenementconference; the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013); 2013-09-25; 2013-09-27 -
Duur: 25 sep 201327 sep 2013

Congres

Congresconference; the 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013); 2013-09-25; 2013-09-27
Verkorte titelTherminic2013
Periode25/09/1327/09/13
Anderthe 19th International Workshop on Thermal Investigations of ICs and Systems (Therminic 2013)

Vingerafdruk Duik in de onderzoeksthema's van 'Integrating advanced interconnect technologies in a high power lighting application : first steps'. Samen vormen ze een unieke vingerafdruk.

Citeer dit