Inferred measurement of subsurface nanosheet structures using scanning probe microscopy, solving the inverse problem

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2 Citaten (Scopus)
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Samenvatting

Metrology challenges surrounding nanosheet structures used in next generation semiconductor devices based around Forksheet and Gate-All-around Field Effect Transistors include procuring measurements in the planar directions, such as critical dimensions, as well as in the vertical direction, such as sheet and recess thicknesses. Subsurface Scanning Probe Microscopy (SSPM) can be used to distinguish and measure features that are buried beneath opaque layers. In this work, we investigate if SSPM can contribute to this challenge and can be used to solve the inverse problem. It is shown that qualitative agreement between modelling and experiments is good, when the experimental contact conditions are sufficient. Quantitative measurements, however, are still out of reach.
Originele taal-2Engels
TitelMetrology, Inspection, and Process Control XXXVI
RedacteurenJohn C. Robinson, Matthew J. Sendelbach
UitgeverijSPIE
Pagina's120530M-1-120530M-9
Aantal pagina's9
ISBN van elektronische versie978151064982
ISBN van geprinte versie9781510649811
DOI's
StatusGepubliceerd - 2022
EvenementSPIE Advanced Lithography + Patterning 2022 - San Jose, Verenigde Staten van Amerika
Duur: 24 apr. 202230 mei 2022

Publicatie series

NaamProceedings of SPIE - The International Society for Optical Engineering
Volume12053
ISSN van geprinte versie0277-786X
ISSN van elektronische versie1996-756X

Congres

CongresSPIE Advanced Lithography + Patterning 2022
Land/RegioVerenigde Staten van Amerika
StadSan Jose
Periode24/04/2230/05/22

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